For Apple iPhone 11 , Pro , Max , SE2 - QianLi iBlack Plus Apple A13 CPU Chip BGA Stencil Template - Black

QianLi iBlack Plus A13 CPU Reballing Stencil | iPhone 11 Series & SE2 The "Plus" edition takes motherboard repair to the next level. This premium stencil features a specialized recessed groove design that perfectly seats the A13 Bionic chip. This prevents "chip swim" and ensures 100% alignment across every BGA pad.

• High-Grade Alloy Steel: Enhanced thickness compared to standard stencils to prevent warping under high-heat rework.

• Laser-Etched Square Holes: Facilitates uniform solder ball formation for the A13 and its RAM layer.

• Rapid Cooling: The iBlack coating dissipates heat quickly, reducing thermal stress on the CPU during the reballing cycle.