For Apple iPhone 8 Plus - IC Chip BGA Direct Heating Reballing Stencil Template

iPhone 8 Plus | IC Chip BGA Direct Heating Reballing Stencil Achieve factory-level soldering precision with this high-grade BGA reballing template. Specifically engineered for the iPhone 8 Plus logic board, this stencil features CNC-machined apertures for perfect solder ball alignment, ensuring a reliable bond for CPUs, Power ICs, and Baseband chips.

• Heat Resistant: High-quality stainless steel prevents warping during direct heating.

• Laser-Cut Precision: Square-hole design ensures solder balls form uniformly without bridging.

• Full IC Coverage: Includes templates for all major iPhone 8 Plus integrated circuits.