For Apple iPhone X - IC Chip BGA Direct Heating Reballing Stencil Template

Master your microsoldering repairs with the Apple iPhone X IC Chip BGA Direct Heating Reballing Stencil. Precision-cut for perfect alignment, this high-grade stencil is designed to withstand direct heat without warping, ensuring consistent solder ball formation every time.

• Direct Heat Compatible: Made from high-quality steel that resists deformation under high temperatures.

• Laser-Cut Accuracy: Perfectly aligned BGA patterns for the iPhone X logic board chips.

• Efficient Workflow: Reduces bridges and "cold" joints for a first-time-fix success rate.