For Apple iPhone 6s , 6s Plus - QianLi iBlack 3D Apple A9 CPU Chip BGA Stencil Template - Black

The Technician’s Edge: QianLi iBlack 3D A9 CPU Stencil Eliminate alignment errors and achieve factory-level precision with the QianLi iBlack 3D Stencil for the Apple A9 SoC. Featuring a unique "stepped" design, this stencil locks the CPU into place, ensuring 100% accurate solder ball placement on the iPhone 6s and 6s Plus.

• 3D Alignment Grooves: Recessed cutouts perfectly cradle the A9 chip for zero-shift reballing.

• Anti-Bulge Technology: The signature "Black" coating resists high-heat warping, maintaining a perfectly flat profile.

• Efficiency Booster: Reduces re-work time by ensuring uniform solder balls in a single pass.