Apple
For Apple iPhone 6s - IC Chip BGA Direct Heating Reballing Stencil Template
iPhone 6s BGA Reballing Stencil – High-Precision Direct Heat Template Achieve perfect solder ball formation with this CNC-laser-cut reballing stencil. Specifically mapped for the iPhone 6s logic board, this template features square-hole technology to prevent solder paste bridging and ensures uniform heating across CPU, Baseband, and Power IC chips. The high-grade Japanese steel construction resists warping under the intense temperatures required for lead-free soldering.
£0.92
Specifications
- BrandPQC
- ConditionNew
- Compatible BrandApple
- Product TypeChip/IC-BGA Stencil
- Compatible Modeliphone 6S