For Apple iPhone 8 - IC Chip BGA Direct Heating Reballing Stencil Template

Master Every Repair: iPhone 8 BGA Direct Heating Reballing Stencil

Achieve factory-level precision with the iPhone 8 BGA Reballing Stencil. Designed for master-level logic board repairs, this stencil features laser-cut apertures for perfect solder ball alignment on CPU, NAND, and PMIC chips. Its high-grade stainless steel construction is built for direct heating, ensuring it maintains its shape under intense thermal stress without warping.

• Anti-Warp Technology: Engineered for direct heating with hot air stations.

• Precision Alignment: CNC-machined holes ensure perfect solder paste deposition every time.

• Full IC Coverage: Specifically templated for the unique chip layout of the iPhone 8 logic board.