For Apple iPhone 7 Plus - IC Chip BGA Direct Heating Reballing Stencil Template

Precision Alignment for Flawless IC Restoration. Achieve factory-perfect solder spheres with the iPhone 7 Plus BGA Reballing Stencil. This high-precision template features laser-cut apertures tailored to the exact pinouts of the iPhone 7 Plus logic board.

• Direct Heat Technology: Specialized alloy construction allows you to apply heat directly to the stencil without the "popcorning" or warping common in lower-grade tools.

• Comprehensive Mapping: Includes footprints for the A10 CPU, PMIC, Audio IC, and Baseband.

• Square-Hole Precision: Laser-etched square holes allow solder paste to release cleanly, preventing bridged connections.